JPH01100444U - - Google Patents

Info

Publication number
JPH01100444U
JPH01100444U JP1987195653U JP19565387U JPH01100444U JP H01100444 U JPH01100444 U JP H01100444U JP 1987195653 U JP1987195653 U JP 1987195653U JP 19565387 U JP19565387 U JP 19565387U JP H01100444 U JPH01100444 U JP H01100444U
Authority
JP
Japan
Prior art keywords
film carrier
electronic component
film
coated
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987195653U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525241Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987195653U priority Critical patent/JPH0525241Y2/ja
Publication of JPH01100444U publication Critical patent/JPH01100444U/ja
Application granted granted Critical
Publication of JPH0525241Y2 publication Critical patent/JPH0525241Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1987195653U 1987-12-23 1987-12-23 Expired - Lifetime JPH0525241Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987195653U JPH0525241Y2 (en]) 1987-12-23 1987-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987195653U JPH0525241Y2 (en]) 1987-12-23 1987-12-23

Publications (2)

Publication Number Publication Date
JPH01100444U true JPH01100444U (en]) 1989-07-05
JPH0525241Y2 JPH0525241Y2 (en]) 1993-06-25

Family

ID=31486322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987195653U Expired - Lifetime JPH0525241Y2 (en]) 1987-12-23 1987-12-23

Country Status (1)

Country Link
JP (1) JPH0525241Y2 (en])

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156560A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor device and its production
JPS58197758A (ja) * 1982-05-12 1983-11-17 Sharp Corp テ−プキヤリア装置及びその実装方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156560A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor device and its production
JPS58197758A (ja) * 1982-05-12 1983-11-17 Sharp Corp テ−プキヤリア装置及びその実装方法

Also Published As

Publication number Publication date
JPH0525241Y2 (en]) 1993-06-25

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